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The present invention relates to ball grid array packages and methods of forming ball grid arrays.
Semiconductor dice are becoming increasingly dense, requiring a corresponding decrease in the size of external contacts. For example, many BGA and CSP devices currently in production have at least one die that includes an array of solder balls that can be placed face down, or xe2x80x9cflipped,xe2x80x9d over onto another surface, such as the surface of a printed circuit board. Typically, as the area of the solder balls that are in contact with the surface of the printed circuit board increases, the arrangement of the solder balls becomes more dense, and thus the array of solder balls becomes more compact.
For example, a conventional BGA semiconductor package includes a substrate such as a heat sink substrate including a series of metal plated openings in a first surface of the heat sink substrate. The package also includes at least one semiconductor die bonded to the first surface of the heat sink substrate. The package further includes a conformal film attached to the second surface of the heat sink substrate opposite the first surface. The conformal film is substantially impermeable to moisture. At least one through hole (or xe2x80x9cviaxe2x80x9d) extends through the film. The chip is attached to the surface of the heat sink substrate containing the metal plated openings so that the solder balls of the chip protrude through the openings. The leads of the chip are attached to the surface of the substrate opposite the conformal film using a conventional thin film, wire-bonded or flip chip attachment method.
During the conventional process of attaching the solder balls to the substrate, the solder ball material tends to flow out from the openings in the substrate toward the openings in the film. As a result, the pitch of the balls is increased, so that the spacing between balls is small, thereby increasing the density of the array of balls.
The ball grid array packages are typically formed by applying a conformal film to a substrate, such as a heat sink substrate, with the substrate having a series of holes (or xe2x80x9cviasxe2x80x9d) extending therethrough. The conform
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